Advanced Component Titlesheet 002

Implementing Advanced “Bleeding Edge” Component Technologies

$150.00

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Product Description

The circuit board assembler is constantly challenged by components that seem to defy logic and manufacturability.  Passives such as 0201s and 01005s, while bringing happiness to the designer with regard to layout densities are the bane of the assembler.  IC packaging also has adhered to the mantra of “smaller, faster” taunting the assembler with land-grid arrays (or no lead packages) and high-density CSPs and Flip-chips.  Yet, manufacturing PCBAs with these “bleedking edge” components is not insurmountable, (though not for the weak of heart).

This Coursebook, from the ITM “Implementing Advanced “Bleeding Edge” Component Tecnologies” workshop is intended to provide the experienced participant with a practical approach towards dealing with the most challenging of component packages.   Optimizing the SMT assembly process, as it pertains to very small and high-density components is covered, step by step including DFM guidelines, solder paste, Screen/Stencil Printing, Component Placement, and Reflow.

I.          Component Issues

·         Very Small Passives

o       0201s

o       01005s

·         ICs

o       LGAs and NQFPs

o       CSPs and Flip-chips

·         Moisture Sensitive Devices (MSDs)

o       Issues and Specifications

o       Tracking

II.         Design for Manufacturability Considerations  (Overview)

Pad design – Round vs. Square

Solder Mask considerations

Via in Pad

Component layout proximities

Lead-free PCB finishes

III.        Solder Paste

·         Solder Paste Composition and Behavior:

o       Type 3, 4 and 5

·         Recommendations for 0102 and 01005s

IV.       Solder Paste Printing and Deposition

·         Deposition Basics

·         Screen and Stencil Engineering

o       Stencil Thickness

o       Aperture shape and design

·         Variables and Control

·         Machine Elements and Parameters

V.                 Automatic Component Placement

Feeder considerations

Vision considerations

Variables and Control

VI.        SMT Soldering

·         Reflow Soldering Considerations

·         Variables and Controls

·         Reflow characteristics and challenges of high-mass IC packages

·         Reflow of lead-free area arrays in SnPb processes