Calendar

Feb
26
Mon
BEST PRACTICES FOR IMPROVING MANUFACTURING PRODUCTIVITY – Parts 1 and 2 @ APEX Conference
Feb 26 @ 12:00 pm – 8:00 pm

You have the responsibility and resources to improve the productivity of an assembly operation….what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses.

The Assembly Brothers (of BoardTalk) – Phil Zarrow  and Jim Hall present  a comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.

 


Topics Covered

 

  • Introduction
  • Optimization Objective
    • Getting the most productivity from an existing line
    • Definition of “Best Practices”
  • Process Characterization
  • Design for Manufacturability
  • Best Practices in the Assembly Process
    • Solder Paste Printing process best practices
    • Pick and Place best practices
    • Reflow soldering best practices
    • Wave soldering best practices
    • Selective soldering best practices
    • Cleaning vs No-Clean considerations and best practices
  • Best Practices concerning “challenging technologies”
    • QFNs
    • Ultra-miniature components (0201s, 01005s, ultra-fine pitch BGAs and CSPs
  • Q & A

 

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.

Mar
1
Thu
New Developments In Selective Soldering Technology @ APEX Conference
Mar 1 @ 12:00 pm – 3:00 pm

Bob Klenke, ITM Principal Consultant, presents the “latest and greatest” advancements in Selective Soldering technology and methodology.    This is the guy to get the real story from !

Mar
15
Thu
BEST PRACTICES IN ELECTRONIC ASSEMBLY PROCESSES Workshop @ Best Western Plus Hotel & Suites
Mar 15 all-day

Introduction:
You have the responsibility and resources to improve the productivity of an assembly operation…what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.

Topics Covered:

  • Introduction
  • Optimization Objective
    - Getting the Most Productivity from an Existing Line
    - Definition of “Best Practices”
  • Process Characterization
  • Best Practices in the Assembly Process
    - Solder Paste Printing Process Best Practices
    - Pick and Place Best Practices
    - Reflow Soldering Best Practices
    - Wave Soldering Best Practices
    - Selective Soldering Best Practices
    - Cleaning vs No-Clean Considerations and Best Practices
  • Q & A


Who Should Attend:
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.

Dec
4
Tue
Best Practices for Low Volume – High Mix Assemblies Webinar @ BEST - Business Electronics Soldering Technologies
Dec 4 @ 1:00 pm

Please join us for 2 webinars focused on practices for EMS providers (and OEMs) who cope with Low Volume – High Mix electronic assembly.  Modeled after the popular ITM “Best Practices in SMT Assembly” workshops presented internationally, these webinars are geared towards assemblers who through multiple set-ups during each and every shift.

Jul
24
Wed
SMT ASSEMBLY “BOOT CAMP” @ BEST Inc
Jul 24 – Jul 25 all-day

SMT Assembly “Boot Camp”

 

Course Title:                      SMT Assembly “Boot Camp”

Course Instructor:             Phil Zarrow

Duration:                              2 Days

SMT BOOT CAMP

The SMT Electronics Assembly Class is a practical overview of the many different processes and materials used in through-hole and surface mount technologies (SMT). It is a focused two-day long class, which provides students with the opportunity to learn and understand the processes, tools, and materials used in today’s manufacture of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing related fields.

This 2-day course combines lecture, videos and discussion and is intended for those that are new to electronic assembly and want to “come up to speed” on the processes, materials, equipment and procedures

COURSE OUTLINE

 

DAY ONE

INTRODUCTION

 

PCB FABRICATION OVERVIEW

  1. Circuit board manufacture overview
  2. Surface finish
  3. Legend

 

 

 

SMT ASSEMBLY

  • Solder paste
  1. Nomenclature
  2. Manufacture
  3. Solder characteristics
  4. Flux
  5. Solder Paste considerations

 

  • Stencil Fabrication and Design
  1. Chemical etch
  2. Laser cut
  3. Electroplating
  4. Aperture Design rules
  5. Special Aperture

 

  • Solder Paste Printing
  1. Dispensing options
  2. Fiducials
  3. Solder deposition
  4. Process parameters
  5. Process considerations

 

DAY TWO

  • Component placement
  1. Machine types
  2. Feeder types
  3. Placement considerations

 

  • Reflow
  1. Reflow Oven types
  2. Vapor Phase
  3. Profile development
  4. Reflow considerations

 

  • Wave Soldering
  1. Machine types
  2. Profile development
  3. Process considerations

 

 

 

  • Selective Soldering
  1. Machine types
  2. Profile development
  3. Process considerations

 

  • Cleaning
  1. Contaminants and Corresponding Solvents
  2. Effectiveness of Aqueous Detergents
  3. Cleaning Equipment (Batch and in-line systems)
  4. Cleanability of Components
  5. Driving Forces For No Clean
  6. Cleaning No Clean

 

  • Testing
  1. Testing and Controlling the process through SPC
  2. Inspection points and strategies in the process
  3. AOI
  4. XRAY
  5. Testing considerations

 

  • Questions and Answers Session

 

Sep
23
Mon
DEFECT ANALYSIS and PROCESS TROUBLESHOOTING @ SMTAI
Sep 23 all-day
Jim Hall and *Phil Zarrow, ITM Consulting
Monday, September 23 | 8:30am — 12:00pm and 1:30pm – 5:00 pm

Course Objectives
We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design

Topics Covered
Introduction Prevention: Process Development and Validation Variation (Common Cause) Continuous Improvement Defect Definition Failure Reduced Reliability Process Indicator Special Cause vs. Common Cause Defect Identification Inspection Manual AOI X-Ray Test ICT Functional Contamination False Calls / Escapes Causes of Defects Special Cause vs. Common Cause Variability (repeatability) Accuracy Process not Optimized Root Cause Analysis 5 Whys” Cause and Effect Diagram Process Relationships Incoming Materials Handling Process Problems

 

Defect Analysis and Process Troubleshooting – Phil Zarrow and Jim Hall, ITM Consulting @ SMTAI
Sep 23 all-day

We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design. Presented by Jim Hall and Phil Zarrow of ITM Consulting, industry experts on SMT Processes and Troubleshooting who have been there, done that, and own the ripped tee-shirts!

Sep
25
Wed
Deadly Sins of Electronic Assembly – Phil Zarrow, ITM Consulting @ SMTA - Tucson AZ Chapter
Sep 25 @ 7:30 pm – 8:30 pm

Everyone has heard of the “7 Deadly Sins” that will, supposedly, lead one to Hell. There are also the “Deadly Sins” of SMT – there are more than just 7 – and they can make your assembly process a “hell on earth”.

During the course of ITM’s assembly process audits and troubleshooting consulting work, we tend to see trends in the types of errors and problems. In other words, a lot of people are making the same mistakes. The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%. In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, “do-over”.

This workshop identifies the “deadly sins” of SMT assembly, both for Pb-free and “leaded” processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented. Best Practices will be discussed for each of the key process steps. The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems. It will include identification of vendor and source problems including components and materials as well as design related problems.

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies

Sep
26
Thu
Deadly Sins of Electronic Assembly – Phil Zarrow, ITM Consulting @ SMTA
Sep 26 @ 7:30 pm – 8:30 pm

Everyone has heard of the “7 Deadly Sins” that will, supposedly, lead one to Hell. There are also the “Deadly Sins” of SMT – there are more than just 7 – and they can make your assembly process a “hell on earth”.

During the course of ITM’s assembly process audits and troubleshooting consulting work, we tend to see trends in the types of errors and problems. In other words, a lot of people are making the same mistakes. The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%. In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, “do-over”.

This workshop identifies the “deadly sins” of SMT assembly, both for Pb-free and “leaded” processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented. Best Practices will be discussed for each of the key process steps. The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems. It will include identification of vendor and source problems including components and materials as well as design related problems.

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies

Oct
17
Thu
Deadly Sins of Electronic Assembly @ SMTA - Long Island Chapter
Oct 17 @ 4:30 pm – 5:30 pm

Everyone has heard of the “7 Deadly Sins” that will, supposedly, lead one to Hell. There are also the “Deadly Sins” of SMT – there are more than just 7 – and they can make your assembly process a “hell on earth”.

During the course of ITM’s assembly process audits and troubleshooting consulting work, we tend to see trends in the types of errors and problems. In other words, a lot of people are making the same mistakes. The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%. In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, “do-over”.

This workshop identifies the “deadly sins” of SMT assembly, both for Pb-free and “leaded” processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented. Best Practices will be discussed for each of the key process steps. The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems. It will include identification of vendor and source problems including components and materials as well as design related problems.

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies