Calendar

SMT ASSEMBLY “BOOT CAMP”

 

Course Title:                       SMT Assembly “Boot Camp”

Course Instructor:             Phil Zarrow

Duration:                              2 Days

 

SMT Assembly “BOOT CAMP”

The SMT Electronics Assembly Class is a practical overview of the many different processes and materials used in through-hole and surface mount technologies (SMT). It is a focused two-day long workshop, which provides students with the opportunity to learn and understand the processes, equipment, and materials used in today’s manufacture of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing related fields.

Combining lecture, videos and discussion, this Electronic Assembly Basic Training workshop was designed to give a very comprehensive and complete ‘immersion’ into SMT and mixed technology PCB assembly.  People who are new to the field as well as somewhat experienced personnel who want to “fill in the gaps” have found this workshop to be a perfect solution.  As it runs only two days, it is extensive (and non-superfluous) without taking people ‘out of the shop’ for an extended period of time: learn, absorb and take that knowledge back to the manufacturing floor.

 

 

COURSE OUTLINE

 

DAY ONE

INTRODUCTION – “It’s what we do”

 

PCB FABRICATION OVERVIEW

• Circuit board fabrication overview
• Surface finish
• Legend

 

SMT ASSEMBLY MATERIALS

Solder paste

• Solder paste
  • Flux
  • Alloy
• Solder paste characteristics
• Solder paste considerations
• Adhesives

 

Stencil Fabrication and Design

• Stencil Components
• Stencil fabrication and characteristics
  • Laser cut
  • Electroplating
  • Nano-coating
• Fiducials
• Aperture design rules
• Special apertures

 

SMT ASSEMBLY PROCESSES AND EQUIPMENT

 

Solder Paste Printing and Deposition

• Solder Paste
  • Composition and attributes
• Solder deposition Basics
• Process parameters, control and effects
• Process considerations
• Process defect recognition and avoidance
• Solder jetting

 

QUESTIONS AND ANSWERS SESSION

 

DAY TWO

SMT ASSEMBLY PROCESSES AND EQUIPMENT (Continued)

 

Component Placement

• Machine types and characteristics
• Feeder types
  • Attributes and characteristics
• Placement considerations and parameters
• Set-up and change-over
• Avoiding placement defects
• Line balancing

 

• Reflow Soldering

• Reflow profile
  • Reflow profile characteristics
  • Reflow specification derivation
• PCBA profile development procedure
  • Thermocouple location
  • Thermocouple attachment methodology
  • Attaining the specified profile
• Reflow Oven types and characteristics
  • Convection Dominant (Forced Convection)
  • Vapor Phase
•  Intrusive (Pin-in-Paste) Reflow

 

• Wave Soldering

• Machine types
• Profile development
• Process considerations

 

• Selective Soldering
  • Aperture Fixtures
  • Selective soldering machine types
  • Process considerations
  • Selective soldering DFM considerations
  • Profile development

 

• Cleaning
  1. Contaminants and Corresponding Solvents
  2. Effectiveness of Aqueous Detergents
  3. Cleaning Equipment (Batch and in-line systems)
  4. Cleanability of Components
  5. Driving Forces For No Clean
  6. Cleaning No Clean

 

• Inspection and Testing
  1. Testing and Controlling the process through SPC
  2. Inspection points and strategies in the process
  3. SPI
  4. AOI
  5. X-ray
  6. Testing considerations

 

SUMMARY

 

QUESTIONS AND ANSWERS SESSION