Calendar

Feb
6
Thu
TROUBLESHOOTING AND PROCESS OPTIMIZATION – Lessons Learned from a Decade of BoardTalk @ APEX Expo 2020
Feb 6 @ 11:00 am – 3:00 pm

PD26 Troubleshooting and Process Optimization
– Lessons Learned from the Trenches and a Decade of Board Talk
Phil Zarrow & Jim Hall ITM Consulting Thursday, February 6 9:00 am – 12:00 pm
In over 25 years of consulting, Phil and Jim have just about seen it all! You may be familiar with their popular podcast (started before podcasts existed), Board Talk, which addresses industry issues with deep understanding and a sense of humor. Join the “Assembly Brothers” for a journey through troubleshooting the most common defects in SMT with an emphasis on identifying the fundamental root causes, and an entertaining overview of best practices.
Topics Include:
Issue Questions from the BoardTalk Crypt:
1. Why do we get voids in certain solder joints?
2. Do we need to clean No-Clean residues before Conformal Coating?
3. What is Causing Intermittent BGA Failures?
4. Should We Measure Solder Paste Thickness?
5. Are there effective countermeasures to “new” defects such as “Graping”, HoP, etc.?
6. Should we consider changing to a newer Solder Paste formulation?
7. What are the Pros and Cons of Cleaning No-Clean?
8. Is HASL a Good Choice for Surface Finish
9. Should we change from Water Soluble fluxes to No-Clean?
10. What are potential issues with introducing Ultra-miniature chip components into our products?
11. Will Nitrogen Reduce Reflow and/or Wave Solder Defects?
12. Does Your Assembly Line Suffer From Floundering Time?
13. Are There Standards Governing Component Polarity Marks
14. How can we reduce tombstoning?
15. Can We Skip Cleaning After Rework?
Q & A – “Stump the Chumps”: Jim and Phil will answer process questions from participants as time permits.
Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies. If you’re involved with SMT assembly and you’ve never encountered defects, you can take a pass on this workshop.

Mar
24
Tue
SMT ASSEMBLY BOOT CAMP with Phil Zarrow @ PCB2DAY - Austin, TX
Mar 24 – Mar 25 all-day

 

 

SMT Assembly “BOOT CAMP”

Phil Zarrow, President and Principal Consultant

ITM Consulting

The SMT Electronics Assembly Boot Camp Workshop is a practical overview of the many different processes and materials used in through-hole and surface mount technologies (SMT). It is a focused two-day long workshop, which provides students with the opportunity to learn and understand the processes, equipment, and materials used in today’s manufacture of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing related fields.

Combining lecture, videos and discussion, this Electronic Assembly Basic Training workshop was designed to give a very comprehensive and complete ‘immersion’ into SMT and mixed technology PCB assembly. People who are new to the field as well as somewhat experienced personnel who want to “fill in the gaps” have found this workshop to be a perfect solution. As it runs only two days, it is extensive (and non-superfluous) without taking people ‘out of the shop’ for an extended period of time: learn, absorb and take that knowledge back to the manufacturing floor.

 


 

COURSE OUTLINE

 

DAY ONE

INTRODUCTION – “It’s what we do”

 

PCB FABRICATION OVERVIEW

  • Circuit board fabrication overview
  • Surface finish
  • Legend

 

SMT ASSEMBLY MATERIALS

Solder paste

  • Solder paste
      • Flux
      • Alloy
  • Solder paste characteristics
  • Solder paste considerations
  • Adhesives

 

Stencil Fabrication and Design

  • Stencil Components
  • Stencil fabrication and characteristics
      • Laser cut
      • Electroplating
      • Nano-coating
  • Fiducials
  • Aperture design rules
  • Special apertures

 

SMT ASSEMBLY PROCESSES AND EQUIPMENT

 

Solder Paste Printing and Deposition

  • Solder Paste
    • Composition and attributes
  • Solder deposition Basics
  • Process parameters, control and effects
  • Process considerations
  • Process defect recognition and avoidance
  • Solder jetting

 

QUESTIONS AND ANSWERS SESSION

 

DAY TWO

SMT ASSEMBLY PROCESSES AND EQUIPMENT (Continued)

 

Component Placement

  • Machine types and characteristics
  • Feeder types
      • Attributes and characteristics
  • Placement considerations and parameters
  • Set-up and change-over
  • Avoiding placement defects
  • Line balancing

 

  • Reflow Soldering

 

  • Reflow profile
    • Reflow profile characteristics
    • Reflow specification derivation
  • PCBA profile development procedure
      • Thermocouple location
      • Thermocouple attachment methodology
      • Attaining the specified profile
  • Reflow Oven types and characteristics
    • Convection Dominant (Forced Convection)
    • Vapor Phase
  • Intrusive (Pin-in-Paste) Reflow

 

  • Wave Soldering

 

    • Machine types
    • Profile development
    • Process considerations

 

  • Selective Soldering
    • Aperture Fixtures
    • Selective soldering machine types
    • Process considerations
    • Selective soldering DFM considerations
    • Profile development
  • Cleaning

 

 

  1. Contaminants and Corresponding Solvents
  2. Effectiveness of Aqueous Detergents
  3. Cleaning Equipment (Batch and in-line systems)
  4. Cleanability of Components
  5. Driving Forces For No Clean
  6. Cleaning No Clean

 

  • Inspection and Testing

 

  1. Testing and Controlling the process through SPC
  2. Inspection points and strategies in the process
  3. SPI
  4. AOI
  5. X-ray
  6. Testing considerations

 

SUMMARY

 

QUESTIONS AND ANSWERS SESSION

Jun
1
Mon
SMT ASSEMBLY “BOOT CAMP” with Phil Zarrow at BEST – Rolling Meadows, IL @ B.E.S.T.
Jun 1 – Jun 3 all-day

SMT ASSEMBLY “BOOT CAMP”

 

Course Title:                       SMT Assembly “Boot Camp”

Course Instructor:             Phil Zarrow

Duration:                              2 Days

 

SMT Assembly “BOOT CAMP”

The SMT Electronics Assembly Class is a practical overview of the many different processes and materials used in through-hole and surface mount technologies (SMT). It is a focused two-day long workshop, which provides students with the opportunity to learn and understand the processes, equipment, and materials used in today’s manufacture of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing related fields.

Combining lecture, videos and discussion, this Electronic Assembly Basic Training workshop was designed to give a very comprehensive and complete ‘immersion’ into SMT and mixed technology PCB assembly.  People who are new to the field as well as somewhat experienced personnel who want to “fill in the gaps” have found this workshop to be a perfect solution.  As it runs only two days, it is extensive (and non-superfluous) without taking people ‘out of the shop’ for an extended period of time: learn, absorb and take that knowledge back to the manufacturing floor.

 


 

COURSE OUTLINE

 

DAY ONE

INTRODUCTION – “It’s what we do”

 

PCB FABRICATION OVERVIEW

  • Circuit board fabrication overview
  • Surface finish
  • Legend

 

SMT ASSEMBLY MATERIALS

Solder paste

  • Solder paste
    • Flux
    • Alloy
  • Solder paste characteristics
  • Solder paste considerations
  • Adhesives

 

Stencil Fabrication and Design

  • Stencil Components
  • Stencil fabrication and characteristics
    • Laser cut
    • Electroplating
    • Nano-coating
  • Fiducials
  • Aperture design rules
  • Special apertures

 

SMT ASSEMBLY PROCESSES AND EQUIPMENT

 

Solder Paste Printing and Deposition

  • Solder Paste
    • Composition and attributes
  • Solder deposition Basics
  • Process parameters, control and effects
  • Process considerations
  • Process defect recognition and avoidance
  • Solder jetting

 

QUESTIONS AND ANSWERS SESSION

 

DAY TWO

SMT ASSEMBLY PROCESSES AND EQUIPMENT (Continued)

 

Component Placement

  • Machine types and characteristics
  • Feeder types
    • Attributes and characteristics
  • Placement considerations and parameters
  • Set-up and change-over
  • Avoiding placement defects
  • Line balancing

 

  • Reflow Soldering
  • Reflow profile
    • Reflow profile characteristics
    • Reflow specification derivation
  • PCBA profile development procedure
      • Thermocouple location
      • Thermocouple attachment methodology
      • Attaining the specified profile
  • Reflow Oven types and characteristics
    • Convection Dominant (Forced Convection)
    • Vapor Phase
  •  Intrusive (Pin-in-Paste) Reflow

 

  • Wave Soldering
    • Machine types
    • Profile development
    • Process considerations

 

  • Selective Soldering
    • Aperture Fixtures
    • Selective soldering machine types
    • Process considerations
    • Selective soldering DFM considerations
    • Profile development

 

  • Cleaning
    1. Contaminants and Corresponding Solvents
    2. Effectiveness of Aqueous Detergents
    3. Cleaning Equipment (Batch and in-line systems)
    4. Cleanability of Components
    5. Driving Forces For No Clean
    6. Cleaning No Clean

 

  • Inspection and Testing
    1. Testing and Controlling the process through SPC
    2. Inspection points and strategies in the process
    3. SPI
    4. AOI
    5. X-ray
    6. Testing considerations

 

SUMMARY

 

QUESTIONS AND ANSWERS SESSION