Board Talk
SMT Manufacturing – Introduction to the Assembly Process
This course is intended to provide the participant with a thorough yet practical overview of Surface Mount Technology manufacturing. The SMT assembly process will be covered, step by step.
Instructors: Phil Zarow, Jim Hall and/or Joe Belmonte
Duration: 1 Day
Topics Covered:
I. The SMT Concept
Surface Mount versus Through-hole technology
Types of SMT assemblies
II. Solder Paste
Solder Paste Composition and Behavior:
Fluxes: RMA, Water Soluble, No-cleans
III. Solder Paste Printing and Deposition
Deposition Basics
Screen and Stencil Engineering
Control and Variables
Machine Elements and Parameters
Machine and Operator Interaction
VI. Automatic Component Placement
Manual and Semi-automatic alternatives
Categorization of Automatic Placement Equipment (Levels I through V)
Flexibility versus Throughput
Feeders
V. SMT Soldering
Wavesoldering
Principles and Methods of Reflow Soldering
Reflow Process Considerations
Atmospheric Soldering (Nitrogen)
Reflow Specification
Reflow Process Trouble-shooting
Who Should Attend:
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management that are just getting involved in SMT assembly and want to become familiar and comfortable with the process and related technologies.
