On-Site SMT Assembly Workshops Customized for the Client
These workshops, performed on-site at your facility and oriented towards the products you build and the equipment, materials and processes you are using.
Soldering Fundamentals: Soldering is the predominant assembly technique in the construction of all electronic products This course will present the fundamentals of soldering as a foundation for virtually all other assembly operations. It will define all the mechanisms and materials of soldering and identify correlations with other individual assembly steps and their significance to overall product quality and process efficiency. The program will consist of a single 1 ½ – 2 hours session. 1
SMT Basics: This is intended to give operators and supervisors a working perspective as to where their operations and equipment fit in to the overall picture. The assembly processes will be covered in relatively non-technical terms. This helps assure that they know the process, what some remedies are to problems and/or when to call Engineering. It also helps “buy-in” to the process. Can be presented as a single or multiple session or as a “lunch and learn” over several successive sessions. 
SMT Boot Camp: This is for manufacturing, process, quality and design engineering (and interested management). The entire process will be covered in depth: materials, components, equipment, processes and troubleshooting. Brings everyone up to the same playing field (and fills in the knowledge gaps that might be present). 
Solder Paste and Printing: For engineers and “advanced” operators” who want to thoroughly understand solder paste and printing process. In addition to solder paste evaluation methodology (a good prelude to solder paste evaluation testing), all aspects of printing will be presented and discussed including proper DOE for set-up, troubleshooting printing defects, post-print inspection and stencil design. Will include hands-on work. 2
Component Placement: For engineers and “advanced” operators who want to thoroughly understand component placement. Component types, tooling, equipment types and troubleshooting will be covered. 2
Reflow Soldering: A very comprehensive workshop on reflow soldering for engineers and “advanced” techs. Will cover profiling and recipe determination, reflow parameters, nitrogen, and troubleshooting. May include hands-on work. 2
MSD Control: For engineers and quality and kitting personnel whose responsibilities include component management and control of moisture sensitive devices. IPC J-Std-033 and other appropriate documentation will be covered.2
Wave Soldering: For engineers and advanced techs/operators working with the wave soldering operations, this comprehensive course will cover all aspects of operation, set-up, profiling, maintenance and troubleshooting.2
Selective Soldering: As more selective soldering equipment and processing is in the future at Teledyne-EMS, this course will present theory of operation, advantages and application, operation, set-up, maintenance and troubleshooting. It will also present considerations for selecting the appropriate equipment from what is on the market. For engineers and advanced techs/operator who are either working with Selective now or are working with wave and likely to be concerned with selective in the near future. This class can be combined with the Wave soldering class if appropriate.2
Assembly Cleaning: For engineers, process, manufacturing and quality, as well as techs, responsible for cleaning. Machine set-up, operation, cleanliness testing techniques and troubleshooting will be discussed.2
DFM Basics: For engineers involved with design reviews, interfacing with customer on dfm issues as well as process and manufacturing engineers affected /impeded by the design. Also for those who will be involved in developing the Teledyne-EMS DFM Guidelines document. All aspects of the assembly process and interactions with design will be examined and discussed.2
Bleeding Edge Technologies: An ITM signature workshop that addresses advanced component, material and process technologies. Printing/stencil characteristics and other aspects of processing micro-passives (0201s, 01005s), QFNs, and lead-free will be covered and discussed. 1
Deadly Sins of SMT Assembly: Another ITM signature workshop that addresses the common mistakes, blunders and bad practices that plague the assembly process. Based upon ITM’s experience in troubleshooting and audits of many processes, “how to do it right” is emphasized. The actual findings of your process audit will be included in this in-house version.1
Identifying Failure Mechanisms: For engineers, process, manufacturing, and quality. Using stencil printing and wave soldering as descriptive examples, this course will present the techniques and procedures of failure analysis for identifying the root cause of product quality problems.
Conformal Coating: This workshop will cover all aspects of conformal coating application including properties, set-up, controlling and other metrics, application techniques and technology, curing and coverage and adhesion testing. 2
SMT Troubleshooting: This course is intended to provide the participant with an understanding of how to identify and correct most SMT assembly problems. Vendor and design related problems will be thoroughly examined. A step-by-step investigation of the assembly process with their related problems and remedies will help the participant achieve high-yield manufacturing. Workmanship standards are also presented and discussed
Avoiding Counterfeit Components and Materials: This workshop is intended to assist electronic assemblers in defining and understanding the practices necessary up and down the supply chain and in-house to avoid incorporating counterfeit and otherwise non-authentic components into the assemblies being built. The goal is to have the highest possible level of security against the threat of counterfeit components and materials.