High Reliability Lean Lead-free SMT Manufacturing


Environmental and economic demands have made electronic manufacturing more challenging than ever.  To be competitive In this day and age, the electronics assembler has to be both Lean and Green.  A daunting task perhaps, but it can be accomplished.

Although many electronics manufacturers are still in transition to the production of RoHS compliant, Lead-Free products, sufficient experience has been gained throughout the industry to move the “science” of Lead-Free design and manufacturing from the investigation phase into at least the first levels of optimization. This must be accomplished in a manner that facilitates the manufacturer’s competitiveness.

 This course teaches the essentials of lean manufacturing as they apply to SMT electronic assembly.  Rather than generalizations, specific applications of lean principles are presented and discussed. Not surprisingly, these lean practices and methodologies compliment and enhance the effectiveness of lead-free manufacturing.

The workshop also presents an objective examination of the current state of the industry in applying and optimizing Lead-free materials, solder, equipment, and processes.

The course examines what the variations in lead-free alloys mean to the electronic assembler at the process and logistics level and choosing specific alloys to enhance reliability for individual applications. The pros and cons of specific available solder alloys are discussed and how these can be utilized to minimize costs, assembly problems such as copper erosion and to enhance the reliability characteristics of certain types of products including handheld devices.  The impact upon printing, placement, reflow and inspection will be examined and the situations confronted by both OEMs and CEMs will also be discussed.

The final part of the course will contend with the implications of lead-free on the SMT assembly process with the most current research and data being presented.  Interactions with substrate finishes and components will be discussed as will the far-reaching implications and  process adaptations that must be made to accommodate no-lead soldering. Conversion to RoHS Compliant, Lead-Free products and manufacturing involves a significant effort in time, materials, and personnel. This course will demonstrate some of the OPPORTUNITIES to use this conversion to create a more efficient and “Lean” production environment with higher yields and less defects.

Instructors:       Jim Hall and/or Phil Zarrow

Duration:            1 Day


The basics of lean manufacturing as specifically applied to electronic assembly and manufacturing.

How to implement best Lean manufacturing practices including 5-S and SPC.

The composition and behavior of lead-free solder and how these affect deposition, reflow, and ultimate solder joint quality for specific applications.

 How to evaluate the properties of different lead-free alloys and take advantages for specific product applications.

The fundamentals of lead-free solder paste deposition and reflow.

The realities of forward and backward compatibility issues, including long-term reliability, and available techniques for dealing with them.

How to use the conversion to Lead-Free Assembly to create a more “LEAN” manufacturing process


Who Should Attend:

This course is intended for Manufacturing, Process, and Quality Engineering personnel and management who are concerned about and wish to become familiar and comfortable with and to take advantage of the benefits of the Lead-Free SMT assembly.  This course will be of benefit to intermediate and advanced SMT users.     Most important, it will give your personnel a perspective on how to implement and optimize the Lead-Free assembly process in the most effective manner.