Class 3 and High Reliability Best Practices

Best Practices in High Reliability (Class 3) Electronic Assembly Processes

Where high reliability electronic products involved there is little or no room for error.  Whether manufacturing military, avionics, medical, automotive or other “mission critical” applications, “escapes” (defective product that fails for the end-user) can be anything from very bad to disastarous.  In addition, mistakes and scrap is usually very expensive.  Problems rooted in the electronic assembly processes can usually be greatly reduced if not eliminated through implementation of accepted best practices in manufacturing.

This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering of Class 3 products.

Instructors:              Phil Zarrow, Jim Hall and/or Joe Belmonte

Duration:                  1.5 days

Topics Covered:

Day 1:

  • Introduction
  • Optimization Objective

    • Getting the most productivity from an existing line
    • Definition of “Best Practices”
  • Some “Deadly Sins” of SMT Assembly
  • Best Practices in the Assembly Process
  • Solder Paste Printing process best practices
  • Pick and Place best practices
  • Reflow soldering best practices
  • Wave and Selective soldering best practices
  • Conformal Coating best practices


Day 2:

  • Soldering Problem Failure Analysis
  • Surviving in a lead-free world when product is exempt
  • Best Practices concerning “challenging technologies”

    • QFNs
    • Ultra-miniature components (0201s, 01005s, ultra-fine pitch BGAs and CSPs
  • Process Optimization best practices

    • Data driven process design
    • Practical use of Design of Experiments (DOE) in electronic manufacturing
    • Practical use of Statistical Process Control (SPC) in electronics manufacturing
    • Manufacturing organization best practices
  • Q & A

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of high reliability and/or Class 3 surface mount or mixed technology assemblies.