Basics of Cleaning Electronic Assemblies


Basics of Cleaning Electronic Assemblies


The complexion and complexities of cleaning electronic assemblies has changed drastically over the last few decades.  A plethora of flux chemistries and their associated soils prevail today presenting challenges with regard to the proper solvent and equipment.  In addition to fluxes, the composition of modern PCBAs  present major complexities including micro-miniature and no-lead components components, PCB materials and surface finishes as well as conformal coating.

While cleaning no-clean fluxes seems like an oxymoron, the necessity and challenges of doing so confronts many assemblers, particularly those building Class 3 and other high-reliability assemblies, ultra-high frequency and microwave products as well as medical. 

This workshop gets into the basics of cleaning contemporary electronic assemblies.  What the soils are and the key elements of successful cleaning.  Metholologies, equipment and cleanliness testing are all examined and discussed.

Instructors:      Phil Zarrow, Joe Belmonte and/or Jim Hall

Duration:            1 Day

Topics Covered

  • Introduction – Why Clean?
  • Flux

    • Composition
    • Challenges
  • Ionic Contamination
  • Brief History of the Cleaning Process

    • Today’s residues are harder to clean
  • Choosing the Correct Cleaning Solution

    • Soils
    • Methodologies
    • Solvents
    • Materials Compatibiltiy
  • Equipment Considerations

    • Elements and Requirements
    • Batch
    • In-line
  • User Perspective
  • Electrical Failures
  • Cost Models
  • Cleanliness Testing

    • Current Test Methods
  • Advantages and Disadvantages

Who Should Attend:

This course is intended for Manufacturing, Process, Design and Quality Engineering personnel, and management with electronic assemblies that must be cleaned. It will give the participant a perspective on how to implement and optimize the cleaning process.