Design for Manufacturability

DESIGN FOR SMT MANUFACTURABILITY
(from an Assembly Point of View)

Course Title: Design for SMT Manufacturability
(from an Assembly Point of View)

Course Instructor: Jim Hall and/or Phil Zarrow

Duration: 1 Day

Objectives of the Course:

Providing a printed circuit design that can be cost effectively reproduced and converted into a high-quality, reliable, functional electronic product requires that the designer have a grasp of the total assembly process. In addition to designing for speed, frequency and packaging requirements, the successful designer must be knowledgeable with respect to the characteristics and capabilities of the SMT assembly process including soldering, placement, cleaning and testing. This on-site course is intended to provide the participant a broad overview of the SMT assembly processes and the design issues associated with manufacturing them. How the design effects manufacturing capability and vice versa will be covered in depth. Equipment, processes and materials specific to the client will receive additional focus.

I. Substrate Parameters
• Typical Substrate Materials
• PCB Structure
• TCE Mismatches
• Substrate Material Properties

II. Component Considerations
• Overview of Package Types
• New & Emerging Packages
• Standardization Rules for Design
• Component Density
• Recommended Land Patterns for New Packages
• Connector Types & Considerations
• Moisture Sensitive Devices

III. Layout Geometry Consideration: Chip Components & Actives
• Solder Pad Design
• Solder Mask Design
• Trace-Pad Design
• Component Orientation

IV. Design Guidelines for SMT
• Fiducial Marks
• Conductor Routing: Near & Entering Pads
• Via Hole Placement
• Mixed Technology Considerations
• Component Spacing
• Component Orientation
• Component Location
• Edge Clearances
• Design for Inspectability

V. Design Standards
• IPC
• EIA
• Other Sources and References

VI. Assembly and Soldering Process Considerations
• Printing
• Component Placement
• Reflow
• Wavesoldering

VII. Other Factors Impacting Design and Manufacturability
• Design for Repairability
• Design for Testability

X. Packaging and Process Directions and Impact
• BGA
• CSP and Flip Chip
• Reflow of Through-hole
• OSP
• No-Clean Process

XI. Discussion
• Questions and Answers pertaining to specific customer application problems

What You Will Learn:

• An understanding of the total SMT assembly process
• How the PCB design impacts the assembly process
• How designing for manufacturability results in higher efficiency in assembly as well as higher yields
• Manufacturing implications of emerging technologies including PCMCIA, Reflow of Through-hole (Intrusive Soldering), Chip-Scale Packaging and others.

Who Should Attend:

This course is intended for Design Engineers, as well as Manufacturing, Process, Test and Quality Engineering personnel and Management who want to become more familiar and comfortable with the Design for Manufacturability requirements of the SMT assembly process.