SMT Manufacturing – Introduction to the Assembly Process

 

                  SMT Manufacturing – Introduction to the Assembly Process

This course is intended to provide the participant with a thorough yet practical overview of Surface Mount Technology manufacturing.  The SMT assembly process will be covered, step by step. 

Instructors:           Phil Zarow, Jim Hall and/or Joe Belmonte

Duration:                1 Day

Topics Covered:

I.  The SMT Concept

     Surface Mount versus Through-hole technology

     Types of SMT assemblies

II.   Solder Paste

     Solder Paste Composition and Behavior:

     Fluxes:  RMA, Water Soluble, No-cleans

III.  Solder Paste Printing and Deposition

     Deposition Basics

     Screen and Stencil Engineering

     Control and Variables

             Machine Elements and Parameters

             Machine and Operator Interaction

VI.  Automatic Component Placement

     Manual and Semi-automatic alternatives

     Categorization of Automatic Placement Equipment (Levels I through V)

             Flexibility versus Throughput

     Feeders

V.  SMT Soldering

   Wavesoldering

   Principles and Methods of Reflow Soldering

  Reflow Process Considerations

 Atmospheric Soldering (Nitrogen)

 Reflow Specification 

Reflow Process Trouble-shooting

Who Should Attend:


This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management that are just getting involved in SMT assembly and want to become familiar and comfortable with the process and related technologies.