Understanding and Implementing Best Practices in Electronic Assembly Processes
Course Instructors: Phil Zarrow, Joe Belmonte and/or Jim Hall
Course Duration: 1 Day or 2 Days
Objectives of the Course:
This is an important workshop that drives awareness and presents solutions to the adverse impact of non-optimal assembly practices and processes.
A comprehensive perspective on problem issues is developed for the electronic assembly process, including design, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved.
I Introduction and Optimization Objective
1. Definition of “Best Practices”
2. Getting the most productivity from an existing line
a. Optimization and Productivity
3. Process Characterization
4. Inspection and Test Planning
II Best Practices in the Assembly Process
1. Material Handling
b. Solder Paste
2. Solder Paste Printing Process Best Practices
a. Stencil design
b. Printer parameters
3. Component Placement Process Best Practices
4. Reflow Soldering Process Best Practices
5. Wave and Selective Soldering Process Best Practices
6. Conformal Coating Best Practices
7. Design for Manufacturability Considerations
a. Data Driven Process Design
b. DOE and SPC
8. Best Practices concerning “Challenging Technologies”
b. Ultra-miniature components ( 0201s, 01005s, ultra fine pitch BGAs & CSPs)
Who Should Attend?
This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.